Beijing Supower Company is the Chinese leader in the production of laser systems, develops constantly updated laser machines using its own technology and multidisciplinary know-how.
Supower state-of-the-art laser cutting machines are available in semi-automatic or fully automatic versions. These high-precision cutting systems perform fast and accurate cutting, drilling and engraving Various materials, including PCD, PCBN, CVD diamond, mono diamond, tungsten carbide, ceramics and silicon wafers, have been among its most successful applications.
With over 7 years hands-on expertise in the area of super-hard materials, Supower has been constantly improving the quality of work for all those who use laser technology for industrial applications.
Classifications of Laser Cutting Machines
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Type
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Characteristics
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LCP
(Microsecond Pulse)
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LCP is ideally suited for the fast cutting of thick materials. It has the advantages of high efficiency, narrower kerf width and less thermal damage when compared with the same products from other companies Its single side depth of cut can reach 6mm, while its double side slicing depth is as much as 10mm. LCP also enables super-hard materials within 2mm thick to be cut at a rate of 60mm/min and above, whereas its laser path could be controlled within 0.1mm. It presently is the mainstream product for the cutting of PCD, PCBN, CVDD, super-hard ceramics, etc.
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LCQ
(Q - CW laser)
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LCQ is mainly applied in the high precision machining and micro-machining of various ultra-hard materials. Its depth of cut and efficiency is far lower than that of LCP, yet it causes far less thermal damage, and it is highly competitive for high precision machining. LCQ performs advantageous efficiency in drilling and grooving, and it also allows an extraordinary range of applications that can not be finished by LCP.
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LCM
(Nanosecond pulse)
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LCM is a newly developed nanosecond giant impulse laser cutting machine, and it very well combines the advantages of both LCP and LCQ. LCM is not merely good at high efficiency cutting of super-hard materials with maximal thickness 4.0 millimeters, its thermal damage is also far lower than LCP. Those problems that mono diamond, CVD diamond and low CBN content PCBN are prone to damage when laser-cut by LCP and that LCQ performs low cutting efficiency are very well solved by this product.
The introduction of LCM is exceedingly significant for high precision cutting of super-hard materials as well as drilling of diamond. It is especially important that, in the drilling of wire dies, LCM can not merely reach outstanding surface finish, it is also competent in high speed drilling and large diameter drilling that are beyond the capabilities of conventional laser drilling machines. It displays far superior performances to any type of laser system in the market.
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Introduction to XBR-LCP
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Machine Type
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LCP20
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LCP40
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LCP80
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Power
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20-25W
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40-50W
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80-100W
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Depth of Cut
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Solid PCD Inserts
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2mm
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3mm
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6mm
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PCD and PCBN backed with cemented tungsten carbide
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2.5mm
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3.5mm
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6mm
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Solid PCBN Inserts
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3.2mm
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4mm
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6mm
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Cemented Carbide
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3.2mm
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4mm
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6mm
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Ceramics, Silicon Wafer
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3.5mm
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5mm
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6mm
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Kerf Width
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0.05-0.15mm
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0.05-0.15mm
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0.10-0.20mm
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Speed Recommended in cutting 1mm thick PCD
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30mm/min
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60mm/min
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120mm/min
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Applications
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Cutting, Drilling, Engraving
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Cutting, Drilling, Engraving
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Cutting, Drilling, Engraving
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Remarks
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Good quality
Medium efficiency
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High quality
High efficiency
Typically recommended to cut cutting tool blanks
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Outstandingly high efficiency
Fairly narrow kerf width
Well suited for cutting thick ultra-hard materials, like PDC for drill bits
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Unit Price
(RMB)
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Routine Model
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250000
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350000
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450000
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Standard Model
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300000
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400000
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500000
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Full functional Model
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350000
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450000
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550000
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